Electronica 2018 in Munich

November 2018

We are really pleased to see you on the exhibition Electronica in Munich. November 13 – 16, 2018. Hall A1, Booth 210.

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Aquisition of APL Oberflächentechnik GmbH

October 2017

Per October 1, 2017 Hofstetter PCB AG took over APL Oberflächentechnik GmbH. The company will be continued with the same operating team under the name of APL Hofstetter PCB GmbH.

APL_HDR_iSn Einlauf_2_internet   Logo_APL_HOF_PCB_GmbH


Productronica 2017 in Munich

November 2017

We are really pleased to see you on the exhibition productronica in Munich. November 14 – 17, 2017. Hall B3, Booth 331.

Bildschirmfoto 2017-10-08 um 15.09.28


Electronica 2016 in Munich

November 2016

We are really pleased to see you on the exhibition electronica in Munich. November 08 – 11, 2016. Hall B4, Booth 519.

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Productronica 2015 in Munich

November 2015

We are really pleased to see you on the exhibition productronica in Munich. November 10 – 13, 2015. Hall B1, Booth 331.

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Electronica 2014 in Munich

November 2014

We are really pleased to see you on the exhibition electronica in Munich. November 11 – 14, 2014. Hall A2, Booth 218.

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ISIG

July 2014

ASIG was successfully substituted, since July total volume production is done by ISIG. More details in the section  processes/technology

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ENEPIG new

October 2011

With the new partly reductive Gold-Electrolyte it would be possible to deposit Gold layer thicknesses up to 0.3 μm! The corrosion of the Nickel layer is minimized.


ASIG (Autocatalytic Silver / Immersion Gold)

May 2010

ASIG, the new nickel free process for final surfaces is now available. Outstanding bonding with aluminium and gold wire as well as excellent soldering compatibility. (Most suitable for flexible circuits with a confined radius.)


Quality Control

March 2010

Two new CVS devices with auto sampler, to determine the organic additives in copper baths and tin electrolytes, were taken into operation. This enables the organic additives to be kept in a narrow window for the different copper electrolytes.

cvs_internet


Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG)

August 2009

The application/process ENEPIG was introduced at the end of June. Excellent coating results can be achieved with the reductive palladium as an intermediate layer. This layer is also very well suited for soldering applications and aluminium wire bonding.

more…


Reel to Reel Copper plating

March 2009

The first 100 m polyimid foil on a width of 610 mm with 5 µm copper plating was delivered to a customer. The base material was a 50 µm thick polimide foil with approx 0.2 µm, using CVD copper.


Microfill 2

January 2009

Blind micro via filling and at the same time metallizing the trough holes. This method is suitable for flex circuits with blind micro vias, ideally 80 – 100 µm diameter. The blind vias of rigid boards with aspect ratios up to 1:10 can be filled at the same time.

more…



Contact

Hofstetter PCB AG
Fännring 10
CH-6403 Küssnacht am Rigi
Téléphone + 41 41 850 50 50
info@hofstetter-pcb.ch

Languages

german
english
french