ASIG was successfully substituted, since July total volume production is done by ISIG. More details in the section processes/technology
With the new partly reductive Gold-Electrolyte it would be possible to deposit Gold layer thicknesses up to 0.3 μm! The corrosion of the Nickel layer is minimized.
ASIG (Autocatalytic Silver / Immersion Gold)
ASIG, the new nickel free process for final surfaces is now available. Outstanding bonding with aluminium and gold wire as well as excellent soldering compatibility. (Most suitable for flexible circuits with a confined radius.)
Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG)
The application/process ENEPIG was introduced at the end of June. Excellent coating results can be achieved with the reductive palladium as an intermediate layer. This layer is also very well suited for soldering applications and aluminium wire bonding.
Reel to Reel Copper plating
The first 100 m polyimid foil on a width of 610 mm with 5 µm copper plating was delivered to a customer. The base material was a 50 µm thick polimide foil with approx 0.2 µm, using CVD copper.
Blind micro via filling and at the same time metallizing the trough holes. This method is suitable for flex circuits with blind micro vias, ideally 80 – 100 µm diameter. The blind vias of rigid boards with aspect ratios up to 1:10 can be filled at the same time.