THF – Through hole filling

THF – Electroplated Copper Filling of Through holes

The 2-stage electroplating process is able to fill through hole vias up to 100% with the simultaneous advantage of lower copper layer thickness on the surface.

Filling vias with copper increases its thermal and electrical conductivity.

PCB’s that have copper filled vias do have an excellent reliability and withstand the currents which are used in high power, radio frequency, microwave and LED applications.

 

Dimensions max. 610 x 460 mm
blaue Linie
Board thickness 25 μm – 0.8 mm
blaue Linie

Filling degree & Board thicknesses

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Processes/Technology > PTH/Pattern Plating > THF – Through hole filling


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Hofstetter PCB AG
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CH-6403 Küssnacht am Rigi
Phone + 41 41 850 50 50
info@hofstetter-pcb.ch

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