THF – Through hole filling
THF – Electroplated Copper Filling of Through holes
The 2-stage electroplating process is able to fill through hole vias up to 100% with the simultaneous advantage of lower copper layer thickness on the surface.
Filling vias with copper increases its thermal and electrical conductivity.
PCB’s that have copper filled vias do have an excellent reliability and withstand the currents which are used in high power, radio frequency, microwave and LED applications.
|Dimensions||max. 610 x 460 mm|
|Board thickness||25 μm – 0.8 mm|