Based one of the direct plating systems or with electrolytic copper
plated trough holes, we build up the pattern plating. With the flexible
system control it is possible to achieve different plating thicknesses.
The copper baths are operated with a pulse plating electrolyte.
|Dimensions||max. 700 x 2000 mm
min. 200 x 200 mm
|Board thickness||0.05 – 15 mm|
|Masking||all known photo resists
(printed inks following testing)
|Aspect Ratio Via Holes||1:10 (higher after preliminary tests)|
|Blind Micro Vias||1:1|