Pattern Plating

Based one of the direct plating systems or with electrolytic copper
plated trough holes, we build up the pattern plating. With the flexible
system control it is possible to achieve different plating thicknesses.
The copper baths are operated with a pulse plating electrolyte.

Dimensions max. 700 x 2000 mm
min. 200 x 200 mm
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Board thickness 0.05 – 15 mm
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Masking all known photo resists
(printed inks following testing)
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Aspect Ratio Via Holes 1:10 (higher after preliminary tests)
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Blind Micro Vias 1:1
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Capacity 200 m²/day
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Contact

Hofstetter PCB AG
Fännring 10
CH-6403 Küssnacht am Rigi
Téléphone + 41 41 850 50 50
info@hofstetter-pcb.ch

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