Pattern Plating

Based one of the direct plating systems or with electrolytic copper
plated trough holes, we build up the pattern plating. With the flexible
system control it is possible to achieve different plating thicknesses.
The copper baths are operated with a pulse plating electrolyte.

Dimensions max. 700 x 2000 mm
min. 200 x 200 mm
blaue Linie
Board thickness 0.05 – 15 mm
blaue Linie
Masking all known photo resists
(printed inks following testing)
blaue Linie
Aspect Ratio Via Holes 1:10 (higher after preliminary tests)
blaue Linie
Blind Micro Vias 1:1
blaue Linie
Capacity 200 m²/day
Print Friendly, PDF & Email


Hofstetter PCB AG
Fännring 10
CH-6403 Küssnacht am Rigi
Téléphone + 41 41 850 50 50