Reductive Gold

Chemical reductive gold is a neutral acting, autocatalytic fine gold bath. This coating is suitable for bonding with gold wire. Circuit boards with different solder stop lacquers can be processed. Complete free development of all holes is important for a fault-free coating.

Coating properties: Reductive Gold

Dimensions  max. 610 x 530 mm
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Au content 99.99 %
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Hardness 60 HV
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Density 19 g /cm3
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Solderability good
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Coating thickness 0.5 – 0.8 μm recommended for
Au wire bonding
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Capacity 30 m/ day
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Contact

Hofstetter PCB AG
Fännring 10
CH-6403 Küssnacht am Rigi
Téléphone + 41 41 850 50 50
info@hofstetter-pcb.ch

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