Reductive Gold

Chemical reductive gold is a neutral acting, autocatalytic fine gold bath. This coating is suitable for bonding with gold wire. Circuit boards with different solder stop lacquers can be processed. Complete free development of all holes is important for a fault-free coating.

Coating properties: Reductive Gold

Dimensions  max. 610 x 530 mm
blaue Linie
Au content 99.99 %
blaue Linie
Hardness 60 HV
blaue Linie
Density 19 g /cm3
blaue Linie
Solderability good
blaue Linie
Coating thickness 0.5 – 0.8 μm recommended for
Au wire bonding
blaue Linie
Capacity 30 m/ day
Print Friendly, PDF & Email


Hofstetter PCB AG
Fännring 10
CH-6403 Küssnacht am Rigi
Téléphone + 41 41 850 50 50