Chemical reductive gold is a neutral acting, autocatalytic fine gold bath. This coating is suitable for bonding with gold wire. Circuit boards with different solder stop lacquers can be processed. Complete free development of all holes is important for a fault-free coating.
Coating properties: Reductive Gold
|Dimensions||max. 610 x 530 mm|
|Au content||99.99 %|
|Density||19 g /cm3|
|Coating thickness||0.5 – 0.8 μm recommended for
Au wire bonding
|Capacity||30 m2 / day|