Electroless Nickel / Palladium / Gold (ENEPIG)

Excellent bonding results for gold wire bonding can be achieved with the reductive plated palladium as intermediate layer. This layer is also very suitable for soldering applications and aluminum wire bonding.

Dimensions max. 630 x 605 mm
min. 100 x 200 mm
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Board thickness 0.050 – 16 mm
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Aspect Ratio 1:15 (PTH free developed)
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Capacity 500 m² / day
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rec. Ni thickness 4 – 7 μm
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rec. Pd thickness >0.05 µm (0.05 – 0.25) for soldering + Al-wire bonding 0.15 µm
(0.05 – 0.25) for soldering + Au-wire bonding
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rec. Au thickness >0.02 µm (0.02 – 0.06) for soldering + Al-wire bonding 0.05 µm
(0.03 – 0.08) for soldering + Au-wire bonding
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Processes/Technology>Final Finishes> Electroless Nickel / Palladium / Gold (ENEPIG)


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Hofstetter PCB AG
Fännring 10
CH-6403 Küssnacht am Rigi
Téléphone + 41 41 850 50 50
info@hofstetter-pcb.ch

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