Microfill 2

This process sequence comprises a horizontal desmear and chemical copper with subsequent electrolytic copper plating in a vertical plant. The advantage of this combination is the high daily capacity of 450 m2 for large series production.

Dimensions max. 650 x 2000 mm
min. 200 x 100 mm
blaue Linie
Board thickness 0.050 – 15.0 mm
blaue Linie
Aspekt Ratios Via Hole 1:10
blaue Linie
Blind Microvia Ø 70 – 120 μm
blaue Linie
Aspect Ratio upto 1:1
blaue Linie
Plating on Surface dependent on Ø and filling ratio
blaue Linie
Capacity by request
Print Friendly, PDF & Email


Contact

Hofstetter PCB AG
Fännring 10
CH-6403 Küssnacht am Rigi
Téléphone + 41 41 850 50 50
info@hofstetter-pcb.ch

Languages

german
english
french