PTH horizontal / Plating horizontal

The electrolytic copper plating takes place in a horizontal plant,
the Segmenta. This plant operates with pulse plating, achieving very good copper distribution on the surface. Outstanding results are achieved with the copper plating of blind microvias using special flooding elements.

Dimensions max. 650 x 2000 mm
min. 350 x 220 mm
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Board thickness max. 3.0 mm
min. 0.1 mm
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Aspect Ratio Bohrung 1:12
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Aspect Ratio Vais 1:1
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Capacity 150 – 200 m² / day
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Reel to Reel max. Bandwidth 650 mm
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Contact

Hofstetter PCB AG
Fännring 10
CH-6403 Küssnacht am Rigi
Téléphone + 41 41 850 50 50
info@hofstetter-pcb.ch

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