Entek Plus 106 A ( X )

This lead-free final surface is an organic copper protective coating (OSP).
The essential benefits of this surface are the planarity and the low thermal stressing. Our installed process permits a selective separation of the OSP coating on copper without the fitting of previously gold plated or other metallic parts (e.g. alumium or tin).

Dimensions max. 650 x 4000 mm
min. open
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Board thickness max. 8.5 mm
min. 0.1 mm
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Coating thickness  0.2 – 0.5μm, typisch 0.3μ
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Capacity 500 m² / day
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Reel to Reel max. strip width 650 mm
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Hofstetter PCB AG
Fännring 10
CH-6403 Küssnacht am Rigi
Téléphone + 41 41 850 50 50