Entek Plus 106 A ( X )
This lead-free final surface is an organic copper protective coating (OSP).
The essential benefits of this surface are the planarity and the low thermal stressing. Our installed process permits a selective separation of the OSP coating on copper without the fitting of previously gold plated or other metallic parts (e.g. alumium or tin).
|Dimensions||max. 650 x 4000 mm
|Board thickness||max. 8.5 mm
min. 0.1 mm
|Coating thickness||0.2 – 0.5μm, typisch 0.3μ|
|Capacity||500 m² / day|
|Reel to Reel||max. strip width 650 mm|