Entek Plus 106 A ( X )
This lead-free final surface is an organic copper protective coating (OSP).
The essential benefits of this surface are the planarity and the low thermal stressing. Our installed process permits a selective separation of the OSP coating on copper without the fitting of previously gold plated or other metallic parts (e.g. alumium or tin).
| Dimensions | max. 650 x 4000 mm min. open |
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| Board thickness | max. 8.5 mm min. 0.1 mm |
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| Coating thickness | 0.2 – 0.5μm, typisch 0.3μ |
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| Capacity | 500 m² / day |
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| Reel to Reel | max. strip width 650 mm |
