Immersion Silver/Immersion Gold (ISIG)

ISIG is a new multifunctional final finish. It shows excellent gold and aluminum wire bondability as well as excellent solderability for any kind of solder application. It is possible to plate a gold thickness up to 0.3 µm. The layer combination is most suitable for high frequency and medical application (nickel free) as well as fine line technology and flexible boards (very thin layer thickness). The semi-automatic equipment allows plating with consistent quality by process control unit automatic dosing.

Format  max. 630 x 605 mm
min.  100 x 200 mm
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Board thickness 0.050 – 16 mm
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Aspect Ratio 1:15  (well developed, residue free)
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Capacity 100 m² / Day
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Ag plating thickness* 0.1 – 0.4 µm
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Au plating thickness* 0.05 – 0.20 µm for solder application
0.10 – 0.20 µm for mixed assembly and wire bonding application
 

*Recommendation of the chemistry and process supplier

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Contact

Hofstetter PCB AG
Fännring 10
CH-6403 Küssnacht am Rigi
Téléphone + 41 41 850 50 50
info@hofstetter-pcb.ch

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