Immersion Silver/Immersion Gold (ISIG)

ISIG is a new multifunctional final finish. It shows excellent gold and aluminum wire bondability as well as excellent solderability for any kind of solder application. It is possible to plate a gold thickness up to 0.3 µm. The layer combination is most suitable for high frequency and medical application (nickel free) as well as fine line technology and flexible boards (very thin layer thickness). The semi-automatic equipment allows plating with consistent quality by process control unit automatic dosing.

Format	max. 630 x 605 mm min.  100 x 200 mm
Board thickness	0.050 – 16 mm
Aspect Ratio	1:15  (well developed, residue free)
Capacity	100 m² / Day
Ag plating thickness*	0.1 – 0.4 µm
Au plating thickness*	0.05 – 0.20 µm for solder application 0.10 – 0.20 µm for mixed assembly and wire bonding application
*Recommendation of the chemistry and process supplier