Immersion Silver

This lead-free surface exhibits very good soldering behaviour also after aging. No growth of inter-metallic phases takes place with aging. The short process time yields very good compatibility with all different kinds of solder masks.

Dimensions max. 610 x 1500 mm
min.  100 x 200 mm
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Board thickness 0.050 – 6.0 mm
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Aspect Ratio 1:12 (higher on request)
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Blind Micro Via 1:1
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Coating thickness 0.15 – 0.45μm
Capacity 500 m² / day
Reel to Reel max. strip width 650 mm
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Contact

Hofstetter PCB AG
Fännring 10
CH-6403 Küssnacht am Rigi
Téléphone + 41 41 850 50 50
info@hofstetter-pcb.ch

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