by admin | May 23, 2023 | Uncategorized
Vertical Plating DPL-3 The variety of printed circuit boards concerning their structure and material type has continuously increased in recent years. The new DPL-3 facility is designed precisely for those new challenges. It can process copper foils with a...
by admin | Dec 4, 2022 | Uncategorized
CONNECTING DIGITALLY WHAT BELONGS TOGETHER The guiding principle of our new website could be something like this. The Hofstetter Group now presents itself together and in a new guise. Thanks to its responsive design, the new website can also be optimally displayed on...
by admin | Dec 4, 2022 | Uncategorized
CONVERSION OF THE ISIG PROCESS TO EPIG OR DIG We would like to inform you that the ISIG process will be discontinued at Hofstetter PCB AG. As a replacement, DIG was introduced at the Küssnacht site, and as an alternative, the nickel-free finish with palladium...
